Study of microstructure development and mechanical characteristics of tin– antimony and tin-antimony-silver lead free solder alloys for microelectronic applications | ||
| البحوث التطبيقية في العلوم والانسانيات | ||
| Volume 2, Issue 1, 2025, Pages 48-59 PDF (1.47 M) | ||
| Document Type: المقالة الأصلية | ||
| DOI: 10.21608/aash.2025.459752 | ||
| Authors | ||
| Reem Hesham Abdel Wahab; Sarah Ashraf Rashad; Sarah Hamdy Abdelkhelik; Sarah Moheb Nassif; Salma Ahmed Hasan; Salma Ahmed AbdelFattah; Salma Samir Mohamed; Maha Mahmoud Mousa | ||
| lecturer, solid state physics Ain Shams University, Faculty of Education | ||
| Abstract | ||
| This study examined the effects of incorporating 1 weight percent Ag element into Sn–5wt%Sb lead free solder on the microstructure and tensile stress strain properties.Optical microscopy (OM), scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were used to analyse the microstructure of both alloys. In addition to forming Ag3Sn IMC with uniform distribution, microstructural investigations showed that adding Ag element to Sn–5wt%Sb solder results in the β-Sn phase's grain refinement. The tensile measurements were carried out at testing temperatures of 25 and 60 oC at a variety of strain rates (ε ̇), from 2.05×10-4 to 1×10-3 sec-1. According to the experimental data, the yield stress (σY) and ultimate tensile strength (σUTS) of the materials under study rise with the addition of Ag and an increase in the strain rates (ε), whereas they decrease with an increase in the deformation temperature. All of the solder alloys that were evaluated had stress exponent values between 2.82 and 6.73. | ||
| Keywords | ||
| Sn-Sb; Ag addition; Microstructure; Stress–strain curves | ||
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