Author = Mahmoud S. Dawood
| Number of Articles: 1 | ||
| 1 | Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications | |
| Volume 54, Issue 1, January 2021, Page 85-96 | ||
| Mahmoud S. Dawood; S. A. Eladly; A. M. El-Taher | ||
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