| 1. | A Significant Role of Rotating Magnetic on Sn-Cu Based Lead Free Solder Alloys for Electronic Applications | |
| Volume 2, Issue 1, 2024, Pages 38-47 | ||
| Hassan Abd Elmoniem; Haydy Abdalla; Hamada Kora | ||
| 2. | Viscoplastic Creep Characterization of Novel Sn–0.7Cu-0.2Ni–xAl Lead-Free Solders for Electronics Applications | |
| Volume 54, Issue 1, January 2021, Pages 85-96 | ||
| Mahmoud S. Dawood; S. A. Eladly; A. M. El-Taher | ||
