CFD Modeling of the Effect of the Air- Cooling on Electronic Heat Sources | ||||
International Journal of Artificial Intelligence and Emerging Technology | ||||
Volume 5, Issue 2, December 2022, Page 49-62 PDF (594.7 K) | ||||
Document Type: Original Article | ||||
DOI: 10.21608/ijaiet.2022.278630 | ||||
View on SCiNiTO | ||||
Authors | ||||
A. E. KABEEL1; A. M. KHALIL1; G. I. SULTAN2; M. I. El-Hadary1 | ||||
1MECHANICAL ENGINEERING DEPARTMENTTANTA UNIVERSITY | ||||
2MECHANICAL ENGINEERING DEPARTMENT – QASSIM UNIVERSITY | ||||
Abstract | ||||
The target of this research is to study the performance of air cooling of an electronic cabinet including a heat sources (electronic circuit boards) by using axial fan. The cabinet is cooled from the top by one port while the lower and side walls temperature is kept constant. The effect of inlet and outlet air ports positions in the cabinet is considered. In this work, Icepak4.2.8 package is used in the numerical study. The steady of the 3D incompressible viscous flow problem is solved by using the Icepak package. Various air-cooling geometries are applied. Specific conditions for each case are defined, and the computational fluid dynamics is provided for three different groups containing six cases of local inlet and outlet ports. The results are performed for cooling effect factor (CEF). | ||||
Keywords | ||||
Air cooling; electronic circuit; CFD; Icepak | ||||
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