A Development and a Physical Properties Characterization of a Conductive Polymer Composite Reinforced with Metallic Particulates and Short Wire Fillers | ||||
| Egyptian Journal of Chemistry | ||||
| Volume 66, Issue 12, December 2023, Page 327-333 PDF (403.99 K) | ||||
| Document Type: Original Article | ||||
| DOI: 10.21608/ejchem.2023.188561.7485 | ||||
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| Authors | ||||
Wessam Saadon Al Azzawi   1; Ahmed F Hasan2; Hala Kadhim2
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| 1Materialss Engineering Dept., College of Engineering, University of Diyala Diyala/Iraq | ||||
| 2Materials Engineering Department; College of Engineering, University of Diyala, 32001 Diyala, Iraq | ||||
| Abstract | ||||
| Metallic particles polymer composites exhibit a remarkable development in the electrical conductivity, with low density compared to metals. Hence, they have become excellent option for the recent electronic technologies, such as smart watches and phones. This study proposes Copper (Cu), Zink (Zn), Tin (Sn) particles, as well as Copper short wires (CSW) as additives to epoxy resin matrix to develop conductive composites. These materials were used due to their high conductivity and affordable coast, when they are dispersed inside the matrix they form a conductive network acts as a charge pathway inside the matrix. Two filler mixtures were used to produce two groups of composites, the first comprises 50 wt% of each of the Sn and the Zn, while the second consists of 50 wt% of each of the Cu and the CSW. Composite samples with different filler content were produced and characterized to assess the electrical conductivity, mechanical properties, and density. The results showed a proportional relationship between the filer content and the conductivity. Moreover, the composites that contain CSW demonstrated almost double the electrical conductivity development compared to the other group. As for the mechanical properties, up to 57% development in the ultimate tensile strength was achieved with the CSW compared to 15% in the other group. Both composite groups demonstrated density increase due to filler inclusion, though the composite with CSW showed 7% lower density. The microstructure investigation revealed some inhomogeneous distribution of the CSW within the matrix at a filler fraction higher than 33%, which could be the reason behind the observed mechanical properties reduction at higher fraction. | ||||
| Keywords | ||||
| Conductive polymers; Metallic particulate composites; Hybrid filler composites | ||||
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