RF-PLASMA PROTECTIVE COATING ON SILVER- COPPER ALLOYS USING HDMSO/O2/AR PRECURSORS | ||||
Egyptian Journal of Archaeological and Restoration Studies | ||||
Article 5, Volume 13, Issue 1, June 2023, Page 61-74 PDF (2.22 MB) | ||||
Document Type: Original Article | ||||
DOI: 10.21608/ejars.2023.305187 | ||||
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Authors | ||||
Abd EL-Moaz, Y.1; Mohamed, W.1; Rifai, M.1; Morgan, N.2; Abdel Ghany, N.3 | ||||
1Conservation dept., Faculty of Archaeology, Cairo Univ., Giza, Egypt | ||||
2Plasma Center, Al-Azhar Univ., Cairo, Egypt. Physics dept., Faculty of Science, Al-Azhar Univ., Cairo, Egypt | ||||
3Physical Chemistry dept., National Research Centre, Dokki, Cairo, Egypt | ||||
Abstract | ||||
Due to its excellent adherence to the metal substrate, Hexamethy-ledisiloxan was employed in the present study to create transparent barrier coating films that protect metal artifacts from corrosion. The deposition procedure used radio frequency plasma enhanced chemical vapor deposition (RF-PECVD). Using scanning electron microscopy combined with energy dispersive X-ray (SEM-EDX) and Fourier-transform infrared spectroscopy (FT-IR), the surfaces of the deposited films were identified and characterized. Atomic force microscopy was used to examine surface topography and roughness (AFM). Water contact angle measurement was used to determine the hydrophobic property (WCA). Moreover, a spectro-scopic ellipsometer was used to measure the film's thickness (SE). Following the Siloxane protective layer's PECVD deposition, colori-metric measurement (CM) was utilized to assess surface appearance alterations. Electr-ochemical impedance spectroscopy (EIS) was used to study how siloxane coatings for metal substrates protect against corrosion as a function of RF power and gas input composition. It was found that the siloxane thin film's adhesion characteristics to the silver-copper alloy substrate were affected by the substrate pret-reatment process and the consumed power during the deposition process. | ||||
Keywords | ||||
Plasma enhanced chemical vapor deposition(PECVD); Thin Films; Adhesion; Silicon dioxide; Argon; Ellipsometry | ||||
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