Thermal modeling of a high fill-factor micromachined bolometer for thermal imaging applications | ||||
| The International Conference on Electrical Engineering | ||||
| Article 81, Volume 6, 6th International Conference on Electrical Engineering ICEENG 2008, May 2008, Page 1-9 PDF (121.47 K) | ||||
| Document Type: Original Article | ||||
| DOI: 10.21608/iceeng.2008.34326 | ||||
 View on SCiNiTO | ||||
| Authors | ||||
| M. Safy; A. Hafz Zaky; A. Mitkes | ||||
| Egyptian Armed Forces. | ||||
| Abstract | ||||
| Abstract: Infrared radiation bolometer which is made of thin film of a aSi:H is thermally modeled using 3-d finite element analysis method (FEA) .This bolometer is realized in a multilevel electro thermal structure having high fill factor. Using the multilevel structure, thermal isolation can be indepentely optimized without sacrificing IR absorption area. The design show that thermal time constant of 12.95 ms, responsivity of 4.65X103V/W,and detcetivity of 7.97X108cm Hz1/2w-1 can be achieved in 50μmx50μm michromachined structure. | ||||
| Keywords | ||||
| Bolometer-Infreared- Thermal Modeling-Micromachined-Detectors-FEA | ||||
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