HEAT TRANSFER CHALLENGES IN SEMICONDUCTORS AND THE POTENTIAL APPLICATIONS OF HEAT PIPES | ||||
| The International Conference on Chemical and Environmental Engineering | ||||
| Article 7, Volume 3, 3rd International Conference On Chemical & Environmental Engineering, May 2006, Page 12-25 PDF (356.98 K) | ||||
| Document Type: Original Article | ||||
| DOI: 10.21608/iccee.2006.41002 | ||||
 View on SCiNiTO | ||||
| Authors | ||||
| Abd El Aleem. F A.; Alahmad M A. | ||||
| College of Engineering, King Saud University, Saudi Arabia. | ||||
| Abstract | ||||
| ABSTRACT The rapid developments in electronics and semiconductors processing led to the use of very compact and precise units with relatively large power and excellent performance. But still the temperature sensitivity and control of such special materials are pronounced and hence its cooling is essential for better performance and smooth operation. Moreover, the dimensions of these electronic components are small and the surface available for heat transfer is also small. Hence, compact cooling means are necessary for effective heat removal from these sensitive materials. In the present work, various cooling technologies applied in electronic systems are analyzed and discussed in view of their cooling potentials and compactness necessary by semiconductor systems. The heat pipe technology was selected in the present work as an efficient tool for heat removal from electronic chips due to its direct cooling via phase change of the working fluid inside and without any external pumping power. Simplified design calculations are also given in the paper for the selected copper-water heat pipe for thermal cooling of an electronic system. | ||||
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