Low Resistivity polymeric adhesives | ||||
| The International Conference on Electrical Engineering | ||||
| Article 56, Volume 1, 1st International Conference on Electrical Engineering ICEENG 1998, March 1998, Page 573-581 PDF (1.21 MB) | ||||
| Document Type: Original Article | ||||
| DOI: 10.21608/iceeng.1998.61995 | ||||
 View on SCiNiTO | ||||
| Authors | ||||
| Sh. R. Gooda; S. M. Hassanien; I. Elfallal | ||||
| Egyptian Armed Forces. | ||||
| Abstract | ||||
| Samples of low resisitivty polymeric adhesives of epoxy type were prepared. Curing took place at the ordinary temperature and hardening was complete within about 15 minutes. The volume resistivity was about 1.5 x 10-4 0 Cm when the sample contained 25% by weight silver. Such low resistivity and short curing time allow the use of mentioned adhesive for repairing the broken low power electrical conductors. The prepared adhesive may also find many applications in electronic packing and silk screening. | ||||
| Keywords | ||||
| Polymeric adhesives; Epoxy adhesives; conductive polymers; conductive epoxy; low resistivity adhesives; welding; low power conductors | ||||
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