Towards 3D Nuclear Detectors | ||||
Menoufia Journal of Electronic Engineering Research | ||||
Article 6, Volume 28, Issue 2, July 2019, Page 79-96 | ||||
Document Type: Original Article | ||||
DOI: 10.21608/mjeer.2019.62767 | ||||
View on SCiNiTO | ||||
Authors | ||||
Abdelhady Ellakany* 1; Mohamed Abouelatta2; I. Hafez2; S. El-Rabaie3; Christian Gontrand4 | ||||
1Dept. of Electronics and Comm., Faculty of Engineering, Ain Shams University. | ||||
2Dept. of Electronics and Comm., Faculty of Engineering, Ain Shams University | ||||
3Dept. of Electronics and Comm., Faculty of Engineering, Menoufia University | ||||
4INL Lab, INSA-Lyon, France | ||||
Abstract | ||||
The main idea of this paper is to indicate the developments of nuclear detectors and explain the advantages of using 3D structures. The 3D detectors are considered as potential candidates with wide band gap material. The 3D semiconductor detectors show advantages over the 2D traditional detectors. The applications include Γ and X-rays detection for Large Hadron Collider (LHC), Super Large Hadron Collider (SLHS) and hard radiation for high energy physics tests. In addition, the fast signal response is needed with sensitive border regions (electrodes) to overcome disadvantages of planar detectors. The unique geometry of 3D detectors with new material like cadmium telluride (CdTe) are satisfying many of these requirements and have several advantages over planar detectors. Hard radiation and short collection time response have become very important for modern SLHC and X-ray imaging for molecular biology. The 3D detectors have fast charge collection times that can arrive to 4×10-12 sec at 15 V and they are also suitable for stopping power up to 3 TeV to meet the future applications of SLHC requirements. | ||||
References | ||||
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